Active Cooling Modules (ACM)

The summary for the Active Cooling Modules (ACM) Federal Grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact. If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the government agency that is offering this grant.
Federal Grant Title: Active Cooling Modules (ACM)
Federal Agency Name: DARPA Microsystems Technology Office
Grant Categories: Science and Technology
Type of Opportunity: Discretionary
Funding Opportunity Number: DARPA-BAA-09-44
Type of Funding: Cooperative Agreement Grant Other Procurement Contract
CFDA Numbers: 12.910
CFDA Descriptions: Research and Technology Development
Current Application Deadline: Apr 22, 2010 Dates Posting Date: April 23, 2009 Abstract Due Date: June 18, 2009, 12:00 PM, Eastern Time First Round Proposal Due Date: August 13, 2009, 12:00 PM, Eastern Time
Original Application Deadline: Apr 22, 2010 Dates Posting Date: April 23, 2009 Abstract Due Date: June 18, 2009, 12:00 PM, Eastern Time First Round Proposal Due Date: August 13, 2009, 12:00 PM, Eastern Time
Posted Date: Apr 23, 2009
Creation Date: Apr 23, 2009
Archive Date: May 14, 2010
Total Program Funding:
Maximum Federal Grant Award: $0
Minimum Federal Grant Award: $0
Expected Number of Awards:
Cost Sharing or Matching: No
Grant Description
DARPA is soliciting innovative research proposals in the area of active cooling modules. DoD systems are driving conflicting needs for high performance as well as reduced size and weight. DARPA makes many investments in new technologies that can improve performance or reduce size and weight. Unfortunately, in many cases, the power consumption of these systems increases with each improvement. As a result, the performance of heat rejection technology remains a key limitation in many applications. The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide tens of degrees of cooling for 100W devices in cm-scale cooling modules with coefficient of performance (COP) of 3 or better. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. E-mail: DARPA-BAA-09-44@darpa.mil; PHONE: (703) 351-8427 for administrative/TFIMS questions; PHONE: (703) 351-8573 for technical questions. DARPA intends to use electronic mail for correspondence regarding DARPA-BAA-09-44. See the full BAA document attached.
Applicants Eligible for this Grant
Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Link to Full Grant Announcement
http://www.darpa.mil/mto/solicitations/index.html
Grant Announcement Contact
Dr. Thomas Kenny, Program Manager DARPA/MTO ATTN: DARPA-BAA-09-44 3701 North Fairfax Drive Arlington, VA 22203-1714
BAA Coordinator [DARPA-BAA-09-44@darpa.mil ]
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