The summary for the Active Cooling Modules (ACM) grant is detailed below.
This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants.
Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact.
If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the U.S. government agency offering this grant.
Active Cooling Modules (ACM): DARPA is soliciting innovative research proposals in the area of active cooling modules. DoD systems are driving conflicting needs for high performance as well as reduced size and weight. DARPA makes many investments in new technologies that can improve performance or reduce size and weight. Unfortunately, in many cases, the power consumption of these systems increases with each improvement. As a result, the performance of heat rejection technology remains a key limitation in many applications. The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide tens of degrees of cooling for 100W devices in cm-scale cooling modules with coefficient of performance (COP) of 3 or better. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. E-mail: DARPA-BAAemail@example.com; PHONE: (703) 351-8427 for administrative/TFIMS questions; PHONE: (703) 351-8573 for technical questions. DARPA intends to use electronic mail for correspondence regarding DARPA-BAA-09-44. See the full BAA document attached.