Active Cooling Modules (ACM)

The summary for the Active Cooling Modules (ACM) Federal Grant is detailed below. It contains information such as the Catalog of Federal Domestic Assistance (CFDA) number, the government agency offering the grant, funding award amounts, and important deadlines. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed in the Grant Announcement Contact section.

Federal Grant Title:	Active Cooling Modules (ACM)
CFDA Number:	12.910
CFDA Description:	Research and Technology Development
Federal Agency Name:	DARPA Microsystems Technology Office
Category of Funding Activity:	Science and Technology
Category Explanation:	Information not provided
Opportunity Category:	Discretionary
Funding Opportunity Number:	DARPA-BAA-09-44
Document Type:	Grants Notice
Funding Instrument Type:	Cooperative Agreement Grant Other Procurement Contract
Posted Date:	Apr 23, 2009
Creation Date:	Apr 23, 2009
Original Closing Date for Applications:	Apr 22, 2010 Dates Posting Date: April 23, 2009 Abstract Due Date: June 18, 2009, 12:00 PM, Eastern Time First Round Proposal Due Date: August 13, 2009, 12:00 PM, Eastern Time
Current Closing Date for Applications:	Apr 22, 2010 Dates Posting Date: April 23, 2009 Abstract Due Date: June 18, 2009, 12:00 PM, Eastern Time First Round Proposal Due Date: August 13, 2009, 12:00 PM, Eastern Time
Archive Date:	May 14, 2010
Expected Number of Awards:	Information not provided
Estimated Total Program Funding:	Information not provided
Federal Grant Award Ceiling:	$0
Federal Grant Award Floor:	$0
Cost Sharing or Matching Requirement:	No

Applicants Eligible for this Grant: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Additional Information on Eligibility: Information not provided
Grant Description: DARPA is soliciting innovative research proposals in the area of active cooling modules. DoD systems are driving conflicting needs for high performance as well as reduced size and weight. DARPA makes many investments in new technologies that can improve performance or reduce size and weight. Unfortunately, in many cases, the power consumption of these systems increases with each improvement. As a result, the performance of heat rejection technology remains a key limitation in many applications. The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide tens of degrees of cooling for 100W devices in cm-scale cooling modules with coefficient of performance (COP) of 3 or better. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. E-mail: DARPA-BAA-09-44@darpa.mil; PHONE: (703) 351-8427 for administrative/TFIMS questions; PHONE: (703) 351-8573 for technical questions. DARPA intends to use electronic mail for correspondence regarding DARPA-BAA-09-44. See the full BAA document attached.
Link to Full Grant Announcement: http://www.darpa.mil/mto/solicitations/index.html
Grant Announcement Contact: Dr. Thomas Kenny, Program Manager DARPA/MTO ATTN: DARPA-BAA-09-44 3701 North Fairfax Drive Arlington, VA 22203-1714 BAA Coordinator [DARPA-BAA-09-44@darpa.mil ]
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