Defense Production Act (DPA) Title III Technology Market Research for 3D Microelectronics for Information Protection Project

The summary for the Defense Production Act (DPA) Title III Technology Market Research for 3D Microelectronics for Information Protection Project grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact. If any section is incomplete, please visit the website for the Air Force Research Lab, which is the U.S. government agency offering this grant.

Defense Production Act (DPA) Title III Technology Market Research for 3D Microelectronics for Information Protection Project: The Title III program has identified 3D High Density Microelectronics for Information Protection as a technology area of interest for its future activities, and interested firms are encouraged to determine if they have information pertaining to this topic. For the purpose of this RFI, the Government is defining 3D High Density Microelectronics for
Information Protection as three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications. The focus shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD and commercial supplier of 3D microelectronics modules incorporating Information Protection.

Note: The program funding above ($100,000) is an estimate only and does not reflect any potential program funding which will be determined at a later date.