Integrity and Reliability of Integrated CircuitS (IRIS)

The summary for the Integrity and Reliability of Integrated CircuitS (IRIS) Federal Grant is detailed below. It contains information such as the Catalog of Federal Domestic Assistance (CFDA) number, who is eligible for the grant, how much grant money will be awarded, important deadlines, and a sampling of similar government grants. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed in the Grant Announcement Contact section. If these sections are incomplete, please visit the website of the government agency that is offering this grant.


	Federal Grant Title:	Integrity and Reliability of Integrated CircuitS (IRIS)
	CFDA Number:	12.910
	CFDA Description:	Research and Technology Development
	Federal Agency Name:	DARPA Microsystems Technology Office
	Category of Funding Activity:	Science and Technology
	Category Explanation:	Information not provided
	Opportunity Category:	Discretionary
	Funding Opportunity Number:	DARPA-BAA-10-33
	Document Type:	Modification to Previous Grants Notice
	Funding Instrument Type:	Cooperative Agreement Grant Other Procurement Contract
	Posted Date:	Sep 15, 2010
	Creation Date:	Nov 16, 2010
	Original Closing Date for Applications:	Dec 07, 2010 Important Dates: Posting Date: September 15, 2010 Industry Day: September 28, 2010 Proposal Abstract Due Date: October 14, 2010 Proposal Due Date: December 07, 2010
	Current Closing Date for Applications:	Dec 17, 2010 Important Dates: Posting Date: September 15, 2010 Industry Day: September 28, 2010 Proposal Abstract Due Date: October 14, 2010 Proposal Due Date: December 17, 2010
	Archive Date:	Jun 17, 2011
	Expected Number of Awards:	Information not provided
	Estimated Total Program Funding:	Information not provided
	Federal Grant Award Ceiling:	$0
	Federal Grant Award Floor:	$0
	Cost Sharing or Matching Requirement:	No

Applicants Eligible for this Grant: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Additional Information on Eligibility: Information not provided
Grant Description: Amendment 03: The purpose of this Amendment is to revise the Full Proposal Due Date as highlighted in yellow in the revised DARPA-BAA-10-33 document attached. Amendment 02: The purpose of this Amendment is to revise the Application Review Information, Section 6, of the BAA as highlighted in yellow. See the revised DARPA-BAA-10-33 attached. Amendment 01: The purpose of this amendment is to revise the abstract and proposal due dates. See the revised full DARPA-BAA-10-33 document with changes highlighted in yellow. Original synopsis below. DARPA is soliciting innovative research proposals in the area of integrated circuit (IC)analysis to determine functionality and reliability of complex integrated circuits for military applications. The objective of the Integrity and Reliability of Integrated Circuits (IRIS) program is to develop the technology to derive the functionality of an IC to determine unambiguously if malicious modifications have been made to that IC, and to accurately determine the IC's useful lifespan from a physical perspective.See full DARPA-BAA-10-33 attached.
Link to Full Grant Announcement: http://www.darpa.mil/mto/solicitations/index.html
Grant Announcement Contact: BAA Coordinator

MTO BAA Coordinator [DARPA-BAA-10-33@darpa.mil]
Similar Government Grants: • Automated Program Analysis for Cybersecurity (APAC); • Social Media in Strategic Communication (SMISC); • Biochronicity; • Build2011-3A-Synopsis01; • Binary Executable Transforms (BET); • Wide Band Gap Semiconductors for RF Applications (WBGS-RF); • Robust Integrated Power Electronics (RIPE); • Microantenna Arrays:Technology and Applications (MIATA); • Imaging Coherent Optical Radar (ICHOR); • Terahertz Imaging Focal Plane Array Technology (TIFT)