Magnetic Miniaturized and Monolithically-Integrated Components (M3IC)
The summary for the Magnetic Miniaturized and Monolithically-Integrated Components (M3IC) grant is detailed below.
This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants.
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If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the U.S. government agency offering this grant.
Magnetic Miniaturized and Monolithically-Integrated Components (M3IC): The DARPA Microsystems Technology Office is soliciting innovative research proposals to develop integrated magnetic components on semiconductor substrates that will reduce size and enable new functionality for U.S. Department of Defense (DoD) electromagnetic (EM) systems.
Proposals will focus on one or more of the following technical areas: 1) integration of
magnetic components on semiconductor substrates, 2) modeling the system-level impact of nonlinear, non-reciprocal, time-dependent magnetic phenomena, and 3) optimization of miniaturized microwave magnetic components. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
Proposals will focus on one or more of the following technical areas: 1) integration of
magnetic components on semiconductor substrates, 2) modeling the system-level impact of nonlinear, non-reciprocal, time-dependent magnetic phenomena, and 3) optimization of miniaturized microwave magnetic components. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
| Federal Grant Title: | Magnetic Miniaturized and Monolithically-Integrated Components (M3IC) |
| Federal Agency Name: | DARPA Microsystems Technology Office |
| Grant Categories: | Science and Technology |
| Type of Opportunity: | Discretionary |
| Funding Opportunity Number: | DARPA-BAA-16-36 |
| Type of Funding: | Cooperative Agreement, Grant, Other, Procurement Contract |
| CFDA Numbers: | 324066 |
| CFDA Descriptions: | Research and Technology Development |
| Current Application Deadline: | Aug 1, 2016 |
| Original Application Deadline: | Aug 1, 2016 |
| Posted Date: | Jun 16, 2016 |
| Creation Date: | Jun 16, 2016 |
| Archive Date: | Aug 31, 2016 |
| Total Program Funding: | $26,000,000 |
| Maximum Federal Grant Award: | none |
| Minimum Federal Grant Award: | none |
| Expected Number of Awards: | |
| Cost Sharing or Matching: | No |
- Applicants Eligible for this Grant
- Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
- Link to Full Grant Announcement
- DARPA Solicitations Page
- Grant Announcement Contact
- Dr. William D. Palmer
DARPA Program Manager
BAA Coordinator
DARPA - Microsystems Technology Office 703-351-8427