Optical Radiation Cooling and Heating in Integrated Devices (ORCHID)

The summary for the Optical Radiation Cooling and Heating in Integrated Devices (ORCHID) grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact. If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the U.S. government agency offering this grant.
Optical Radiation Cooling and Heating in Integrated Devices (ORCHID): Amendment 02: The purpose of this amendment is to add information regarding an available teaming website (see page 15 of conformed BAA). This amendment also corrects a typographical error (located on page 20) regarding the maximum number of pages permitted for Volume 1 of the proposal. Please note that the proposal due date remains unchanged. All changes are highlighted in yellow in the attached conformed full BAA document. Original Synopsis Below. DARPA is soliciting innovative research and development (R&D) proposals in the area of cavity-optomechanics. While mechanical properties of light have long been understood, the idea that light can be used to effectively damp the motion of a macroscopic object is quite new. The ORCHID program is focused on exploiting optomechanical interactions between high-Q optical cavities coupled with high-Q mechanical resonators to damp or amplify the motion of macroscopic mechanical devices. In this context, damping does not lower the bulk temperature of a device; instead it affects only a few of the device's vibrational modes. However, it is these same vibrational modes that can perform transduction in mechanical sensors. As a result, this type of damping can be used to control (in situ) the dynamic range and bandwidths of mechanical sensors and to remove constraints imposed by thermal noise. When optomechanical damping (cooling) is strong enough to remove phonons from the relevant modes, the quantum mechanical properties of the device are expected to become manifest, enabling entirely new sensing and signal processing functionality. By contrast, when phonon energy is transferred from the optical cavity to the mechanical oscillator, its motion can be amplified. Thus, another aspect of the ORCHID program focuses on the development of high frequency regenerative optomechanical oscillators. These oscillators are expected to exhibit reduced linewidth and phase noise. They will be unique in the world of oscillators, as they will feature purely optical input and output for both power and signal. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. (electronic mail: DARPA-BAA-09-26@darpa.mil , fax: 703-496-2069, DARPA/MTO.) See the full BAA document attached.
Federal Grant Title: Optical Radiation Cooling and Heating in Integrated Devices (ORCHID)
Federal Agency Name: DARPA Microsystems Technology Office
Grant Categories: Science and Technology
Type of Opportunity: Discretionary
Funding Opportunity Number: DARPA-BAA-09-26
Type of Funding: Cooperative Agreement Grant Other Procurement Contract
CFDA Numbers: 12.910
CFDA Descriptions: Research and Technology Development
Current Application Deadline: Apr 15, 2010 Due D
Original Application Deadline: Apr 15, 2010 Due D
Posted Date: Apr 15, 2009
Creation Date: Jul 22, 2009
Archive Date: May 06, 2010
Total Program Funding:
Maximum Federal Grant Award: $0
Minimum Federal Grant Award: $0
Expected Number of Awards:
Cost Sharing or Matching: No
Applicants Eligible for this Grant
Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Link to Full Grant Announcement
Information not provided
Grant Announcement Contact
Joe Mangano DARPA/MTO ATTN: DARPA-BAA-09-26 3701 North Fairfax Drive Arlington, VA 22203-1714

BAA Coordinator Email [DARPA-BAA-09-26@darpa.mil]
Similar Government Grants
Computers and Humans Exploring Software Security (CHESS)
SIGMA+ Sensors
Next-Generation Non-Surgical Neurotechnology (N3)
Polyplexus Pilot
Wide Band Gap Semiconductors for RF Applications (WBGS-RF)
Robust Integrated Power Electronics (RIPE)
Microantenna Arrays:Technology and Applications (MIATA)
More Grants from the DARPA Microsystems Technology Office
Millimeter-Wave Digital Arrays (MIDAS)
Electronics Resurgence Initiative: Page 3 Investments Architectures Thrust
Electronics Resurgence Initiative: Page 3 Materials and Integration
Electronics Resurgence Initiative: Page 3 Investments Design Thrust
Lifelong Learning Machines (L2M)

FederalGrants.com is not endorsed by, or affiliated with, any government agency. Copyright ©2018 FederalGrants.com