Primary and Secondary Calibration on Active Layer (PASCAL)
The summary for the Primary and Secondary Calibration on Active Layer (PASCAL) grant is detailed below.
This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants.
Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact.
If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the U.S. government agency offering this grant.
Primary and Secondary Calibration on Active Layer (PASCAL): The program seeks to address challenges associated with the long-term bias and scale-factor drift of chip-scale components for Positioning, Navigation, and Timing (PNT) tasks, and is specifically interested in development of Primary and Secondary Calibration on Active Layer (PASCAL) paradigm for in-situ calibration of inertial sensors and clocks. The deliverable of this program is an integrated, ultra-miniaturized microsystem (gyroscope, accelerometer, and/or clock) with in-situ calibration capabilities strategically implemented on-chip. The effective bias and scale factor deviation of the microsystem should not exceed 1 part per million (< 1 ppm) from a nominal input/output function over a one month period. The total size of the integrated micro-system should be on the order of 30 cubic millimeters (< 30 mm3) and consume less than 50 milliwatt of power (< 50 mW). The micro-system is expected to deliver long-term stability performance in a harsh military environment, with thermal variations from -550C to +850C, vibrations from 5 Hz to 5 kHz with an average amplitude of 5 g, spin rates on the order of 300 Hz, and mechanical shock on the level of 15,000 g. Please note that this Solicitation was originally anticipated to be funded with 6.3 funds only and therefore was only posted to FedBizOpps. However, the anticipated funding type has now changed to include 6.2 funds and has thus been added to Grants.gov to allow for assistance instrument proposals/applications. See DARPA-BAA-11-43 attached.
Federal Grant Title: | Primary and Secondary Calibration on Active Layer (PASCAL) |
Federal Agency Name: | DARPA Microsystems Technology Office |
Grant Categories: | Science and Technology |
Type of Opportunity: | Discretionary |
Funding Opportunity Number: | DARPA-BAA-11-43 |
Type of Funding: | Cooperative Agreement Grant Other Procurement Contract |
CFDA Numbers: | 12.910 |
CFDA Descriptions: | Research and Technology Development |
Current Application Deadline: | Jun 28, 2011 |
Original Application Deadline: | Jun 28, 2011 |
Posted Date: | May 10, 2011 |
Creation Date: | May 10, 2011 |
Archive Date: | Dec 28, 2011 |
Total Program Funding: | |
Maximum Federal Grant Award: | $0 |
Minimum Federal Grant Award: | $0 |
Expected Number of Awards: | |
Cost Sharing or Matching: | No |
- Applicants Eligible for this Grant
- Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
- Link to Full Grant Announcement
- Information not provided
- Grant Announcement Contact
- Andre Shkel DARPA Program Manager
MTO BAA Coordinator [[email protected]] - Similar Government Grants
- • Structures Uniquely Resolved to Guarantee Endurance (SURGE)
- • GOLDen hour extended EVACuation (GOLDEVAC)
- • Material Synthesis Technologies for Universal and Diverse Integration Opportunities (M-STU...
- • Scientific Feasibility (SciFy)
- • Expeditionary Carbon Utilization for energy Resilience and Stabilization (ExCURSion)
- • Wide Band Gap Semiconductors for RF Applications (WBGS-RF)
- • Robust Integrated Power Electronics (RIPE)
- • Microantenna Arrays:Technology and Applications (MIATA)
- More Grants from the DARPA Microsystems Technology Office
- • Material Synthesis Technologies for Universal and Diverse Integration Opportunities (M-STU...
- • Ultra-Wide BandGap Semiconductors (UWBGS)
- • Intensity-Squeezed Photonic Integration for Revolutionary Detectors (INSPIRED)
- • Forward-Looking Experimentation (FLEX)
- • Advanced Sources for Single-event Effects Radiation Testing (ASSERT)