The summary for the Self-HEALing mixed-signal Integrated Circuits (HEALICs) grant is detailed below.
This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants.
Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact.
If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the U.S. government agency offering this grant.
Self-HEALing mixed-signal Integrated Circuits (HEALICs): The purpose of this modification is to extend the due date of the Full proposals to 9 September 2008 and to add an attachment. See the attached conform BAA document. Original notice below.DARPA is soliciting innovative research and development (R&D) proposals in the area of self-healing mixed signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The goal of the program is the development of techniques to maximize the number of fully operational mixed-signal SoCs on an individual wafer that meet all performance goals in the presence of extreme process variations and environmental conditions. See attached full BAA document. Submit your questions to BAA08firstname.lastname@example.org