The summary for the Self-HEALing mixed-signal Integrated Circuits (HEALICs) Federal Grant is detailed below.
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Cooperative Agreement Grant Other Procurement Contract
Research and Technology Development
Current Application Deadline:
May 19, 2009 Dates: Proposal Abstract Due Date and time -4:00 PM EST July 9, 2008 Proposal Due Date and time - 4:00 PM EST September 9, 2008 Proposer's Day - June 19, 2008
Original Application Deadline:
May 19, 2009 Dates: Proposal Abstract Due Date and time -4:00 PM EST July 9, 2008 Proposal Due Date and time - 4:00 PM EST September 3, 2008 Proposer's Day - June 19, 2008
May 21, 2008
Aug 06, 2008
Jun 22, 2009
Total Program Funding:
Maximum Federal Grant Award:
Minimum Federal Grant Award:
Expected Number of Awards:
Cost Sharing or Matching:
The purpose of this modification is to extend the due date of the Full proposals to 9 September 2008 and to add an attachment. See the attached conform BAA document. Original notice below.DARPA is soliciting innovative research and development (R&D) proposals in the area of self-healing mixed signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The goal of the program is the development of techniques to maximize the number of fully operational mixed-signal SoCs on an individual wafer that meet all performance goals in the presence of extreme process variations and environmental conditions. See attached full BAA document. Submit your questions to BAA08firstname.lastname@example.org
Applicants Eligible for this Grant
Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Link to Full Grant Announcement
Grant Announcement Contact
Dr. Sanjay Raman DARPA Program Manager Microsystems Technology Office 3701 North Fairfax Drive Arlington, VA 22203-1714 Fax: (703) 248-8062 Phone: (571) 218-4339 BAA Coordinator [BAA08email@example.com]