Self-HEALing mixed-signal Integrated Circuits (HEALICs)
The summary for the Self-HEALing mixed-signal Integrated Circuits (HEALICs) Federal Grant is detailed below.
It contains information such as the Catalog of Federal Domestic Assistance (CFDA) number, who is eligible for the grant, how much grant money will be awarded, important deadlines, and a sampling of similar government grants.
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| Federal Grant Title: | SELF-HEALING MIXED-SIGNAL INTEGRATED CIRCUITS (HEALICS) |
| Federal Agency Name: | DARPA Microsystems Technology Office |
| Program Name: | Research and Technology Development |
| Grant Categories: | Science and Technology |
| CFDA Number: | 12.910 |
| Funding Opportunity Number: | DARPA-BAA-08-40 |
| Posted Date: | May 21, 2008 |
| Creation Date: | Aug 06, 2008 |
| Original Application Deadline: | May 19, 2009 Dates: Proposal Abstract Due Date and time -4:00 PM EST July 9, 2008 Proposal Due Date and time - 4:00 PM EST September 3, 2008 Proposer's Day - June 19, 2008 |
| Current Application Deadline: | May 19, 2009 Dates: Proposal Abstract Due Date and time -4:00 PM EST July 9, 2008 Proposal Due Date and time - 4:00 PM EST September 9, 2008 Proposer's Day - June 19, 2008 |
| Archive Date: | Jun 22, 2009 |
| Total Program Funding: | Information not provided |
| Maximum Federal Grant Award: | $0 |
| Minimum Federal Grant Award: | $0 |
| Expected Number of Awards: | Information not provided |
| Cost Sharing or Matching: | No |
- Applicants Eligible for this Grant
- Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
- Additional Information on Eligibility
- Information not provided
- Grant Description
- The purpose of this modification is to extend the due date of the Full proposals to 9 September 2008 and to add an attachment. See the attached conform BAA document. Original notice below.DARPA is soliciting innovative research and development (R&D) proposals in the area of self-healing mixed signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The goal of the program is the development of techniques to maximize the number of fully operational mixed-signal SoCs on an individual wafer that meet all performance goals in the presence of extreme process variations and environmental conditions. See attached full BAA document. Submit your questions to BAA08-40@darpa.mil
- Link to Full Grant Announcement
-
http://www.darpa.mil/baa/#eto
- Grant Announcement Contact
- Dr. Sanjay Raman DARPA Program Manager Microsystems Technology Office 3701 North Fairfax Drive Arlington, VA 22203-1714 Fax: (703) 248-8062 Phone: (571) 218-4339
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