Silicon Carbide Advanced Packaging Of Power Semiconductors Ii

The summary for the Silicon Carbide Advanced Packaging Of Power Semiconductors Ii grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants. Verify the accuracy of the data provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact. If any section is incomplete, please visit the website for the Dept of the Army Materiel Command, which is the U.S. government agency offering this grant.
Silicon Carbide Advanced Packaging Of Power Semiconductors Ii: SILICON CARBIDE ADVANCED PACKAGING OF POWER SEMICONDUCTORS II The U.S. Army Contracting Command – Aberdeen Proving Ground, Research Triangle Park Division, on behalf of the U.S. Army Research Laboratory, Sensors and Electron Devices Directorate (SEDD) is soliciting proposals for the Advanced Packaging of Power Semiconductors (APPS) II program under: “3.) SCIENCES FOR MANEUVER (ScMVR) CAMPAIGN b.) KCI-ScMVR-2: Advanced, Electrical Power Technologies and Components iii.) Power Electronics Packaging” of the ARL Core Broad Agency Announcement (BAA) for Basic and Applied Scientific Research, W911NF-17-S-0003. ARL is soliciting proposals under this Special Notice of the BAA for the performance of applied research focused on extending the state-of-the-art in multi-die packaging of semiconductor devices for high-power applications. The aim of this Special Notice under the BAA is to address the current limitations of conventional packaging and support the recent advancements in silicon carbide (SiC) power device technology for military and commercial applications. Wide bandgap power semiconductors, such as SiC, have emerged with properties that allow them to far surpass the performance of conventional silicon (Si) power technology and make them prime candidates for next-generation high-power switching devices for military, as well as commercial, applications. SiC power devices have demonstrated greater than twice the power density of Si power devices and at greater efficiency. Traditional power packaging approaches are now the limiting factor in fully realizing the performance benefits offered by SiC power device technology. Conventional power packaging has a number of opportunities for improvement including, but not limited to, parasitic inductance, heat removal capability, reliability (wirebonds, DBC, large area contacts), transient thermal mitigation, planar packaging, and standard subtractive manufacturing. Solutions are sought for the development of holistic, multiphysics approaches to power module development that address electrical, thermal and thermomechanical issues in a coupled manner to realize the full performance of SiC semiconductor devices. SiC is being explored and/or implemented for low voltage (600 V to 3.3 kV), medium voltage (3.3 kV – 10 kV), and high voltage (10 kV – 24 kV) military and/or commercial applications. Depending on the voltage class and current levels involved, electrical considerations may include high dv/dt capability, partial discharge, electromagnetic interference (EMI), common mode current from parasitic capacitance, inductance, miller capacitance, and internal/external electrical connections. Thermal considerations may include heat dissipation capability, transient absorption, package thermal resistance, and internal/external thermal interfacing. The thermomechanical aspects may include compliant interface materials, coefficient of thermal expansion matching and thermal/power cycling capability. The above enumeration of considerations is not all-inclusive nor exhaustive. A proposal must provide an innovative packaging solution which integrates innovative design processes, numerical analyses, novel configurations, thermal management, advanced manufacturing technologies, novel materials, electrical components (gate-drivers, protection, passives), and/or sensing. Joint proposals among industry, research, and/or academia are encouraged to meet the holistic and disruptive goals of this program. The Army is interested in advancing the state-of-the-art of power packaging technology for a wide range of applications. It is anticipated that, over the period of performance, an Applicant will be able to demonstrate an advanced module design that provides dramatic improvements over conventional packaging methodologies. There will be no equipment purchases using federal funds associated with awards made as a result of this Special Notice. Funding is currently available for up to four cooperative agreements related to the SiC APPS II program for the Fiscal Year (FY) 2018. However, the Government reserves the right to award fewer, or even no awards based on the proposals received from this Special Notice. While the BAA and Topic remain open for proposal submission until 31 March 2022, in order to be eligible for award under this Special Notice with the funding available for FY 2018, proposals must be received in accordance with the due dates and instructions provided in this announcement. It is anticipated that up to four cooperative agreements (31 USC 6305) will be awarded, pursuant to 10 USC 2358 Research Projects. The total amount for all awards is anticipated to be approximately $2,500,000.00 per year for up to three years subject to available funds. Proposals should include a detailed plan and budget for the first year and also anticipated work for the two option years. Cost sharing is not required under this notice. However, during the evaluation of proposals, any cost sharing will be evaluated as it relates to the evaluation factors listed in the BAA, based on the degree to which the proposed cost sharing enhances the proposal to result in added benefits to the program. To allow for evaluation of a proposed cost sharing, a proposal should express a firm commitment to provide such cost share and evidence a process for integrating the cost share into the research program The principal purpose of a cooperative agreement is for the public purpose of support and stimulation of fundamental research and not the acquisition of property or provision of services for the direct benefit or use of the Government. A Recipient of a cooperative agreement will work collaboratively with scientists from ARL to further the SiC APPS II program. ARL will participate in the research and use its strong in-house technical expertise to jointly plan and execute the research program with a Recipient. In order to be eligible for a cooperative agreement under this program, applicants must submit proposals in accordance with the submission instructions under BAA W911NF-17-S-0003, Section II.D no later than 6 October 2017. A Proposal submitted after this closing date will not be considered by the Government. Criteria for eligible Applicants are given in BAA, Section II.C.1. Proposals will be evaluated using the criteria listed in the BAA, Section II.E. Under this Special Notice, no formal Q&A will take place. If an applicant has a question regarding technical clarification related to this Special Notice, contact Mr. Dimeji Ibitayo at . For general assistance, contact Julia Wertley-Rotenberry at . Upon submission, an Applicant is encouraged to provide notification to both Mr. Dimeji Ibitayo and Julia Wertley-Rotenberry by email. This Special Notice expires 6 October 2017 at 11:59 PM (EDT).
Federal Grant Title: Silicon Carbide Advanced Packaging Of Power Semiconductors Ii
Federal Agency Name: Dept of the Army Materiel Command (DOD-AMC)
Grant Categories: Science and Technology
Type of Opportunity: Other
Funding Opportunity Number: W911NF17S0003-SCAPOPS
Type of Funding: Cooperative Agreement
CFDA Numbers: 12.431
CFDA Descriptions: Information not provided
Current Application Deadline: October 6th, 2017
Original Application Deadline: October 6th, 2017
Posted Date: September 7th, 2017
Creation Date: September 7th, 2017
Archive Date: No date given
Total Program Funding: $2,500,000
Maximum Federal Grant Award: $2,500,000
Minimum Federal Grant Award: $0
Expected Number of Awards: 4
Cost Sharing or Matching: No
Last Updated: September 7th, 2017
Applicants Eligible for this Grant
Unrestricted (i.e., open to any type of entity below), subject to any clarification in text field entitled "Additional Information on Eligibility"
Grant Announcement Contact
Julia Wertley-Rotenberry
Grants Officer
Phone 919-541-4691
Business POC
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