Wafer Scale Infrared Detectors (WIRED)
The summary for the Wafer Scale Infrared Detectors (WIRED) grant is detailed below.
This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants.
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If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the U.S. government agency offering this grant.
Wafer Scale Infrared Detectors (WIRED): DARPA is soliciting research proposals to develop novel technologies for infrared sensors. The WIRED program seeks to provide high-performance, low-cost infrared imagers that respond in the short wave infrared (SWIR) and mid wave infrared (MWIR), and that can be fabricated directly on silicon-based readout integrated circuit (ROIC) substrates at the wafer scale. Also of interest are innovative approaches to high temperature long wave infrared (LWIR) detectors that directly measure photocurrent.
Federal Grant Title: | Wafer Scale Infrared Detectors (WIRED) |
Federal Agency Name: | DARPA Microsystems Technology Office |
Grant Categories: | Science and Technology |
Type of Opportunity: | Discretionary |
Funding Opportunity Number: | DARPA-BAA-15-57 |
Type of Funding: | Cooperative Agreement, Grant, Other, Procurement Contract |
CFDA Numbers: | 12.910 |
CFDA Descriptions: | Research and Technology Development |
Current Application Deadline: | Nov 23, 2015 |
Original Application Deadline: | Nov 23, 2015 |
Posted Date: | Sep 10, 2015 |
Creation Date: | Sep 10, 2015 |
Archive Date: | May 31, 2016 |
Total Program Funding: | |
Maximum Federal Grant Award: | $0 |
Minimum Federal Grant Award: | $0 |
Expected Number of Awards: | |
Cost Sharing or Matching: | No |
- Applicants Eligible for this Grant
- Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
- Link to Full Grant Announcement
- MTO Solicitations Page
- Grant Announcement Contact
- Dr. Jay Lewis
Program Manager
BAA Coordinator
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