Wafer Scale Infrared Detectors (WIRED)

The summary for the Wafer Scale Infrared Detectors (WIRED) grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact. If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the U.S. government agency offering this grant.
Wafer Scale Infrared Detectors (WIRED): DARPA is soliciting research proposals to develop novel technologies for infrared sensors. The WIRED program seeks to provide high-performance, low-cost infrared imagers that respond in the short wave infrared (SWIR) and mid wave infrared (MWIR), and that can be fabricated directly on silicon-based readout integrated circuit (ROIC) substrates at the wafer scale. Also of interest are innovative approaches to high temperature long wave infrared (LWIR) detectors that directly measure photocurrent.
Federal Grant Title: Wafer Scale Infrared Detectors (WIRED)
Federal Agency Name: DARPA Microsystems Technology Office
Grant Categories: Science and Technology
Type of Opportunity: Discretionary
Funding Opportunity Number: DARPA-BAA-15-57
Type of Funding: Cooperative Agreement, Grant, Other, Procurement Contract
CFDA Numbers: 12.910
CFDA Descriptions: Research and Technology Development
Current Application Deadline: Nov 23, 2015
Original Application Deadline: Nov 23, 2015
Posted Date: Sep 10, 2015
Creation Date: Sep 10, 2015
Archive Date: May 31, 2016
Total Program Funding:
Maximum Federal Grant Award: $0
Minimum Federal Grant Award: $0
Expected Number of Awards:
Cost Sharing or Matching: No
Applicants Eligible for this Grant
Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Link to Full Grant Announcement
MTO Solicitations Page
Grant Announcement Contact
Dr. Jay Lewis Program Manager
BAA Coordinator

DARPA - Microsystems Technology Office 703-351-8427
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