Micro-Sensors for Imaging (MISI)

The summary for the Micro-Sensors for Imaging (MISI) grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact. If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the U.S. government agency offering this grant.
Micro-Sensors for Imaging (MISI): Micro-Sensors for Imaging (MISI). SOL BAA 06-46, DUE 011207 POC Mr. Ray Balcerak, DARPA/MTO, FAX (703) 696-2206PROGRAM OBJECTIVES AND DESCRIPTIONThe Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of Micro-Sensors for Imaging. The objective of this effort is to develop technologies for extremely light weight micro-cameras sensitive in the visible to short wave and in longer wave infrared; and to demonstrate such camera systems in micro-vehicles and head mounted applications. The proposed research should investigate and exploit innovative approaches that will enable revolutionary advances in science, materials, detectors, focal plane arrays, micro-packaging, optics, electronics and signal processing leading to extremely light weight cameras. Specifically excluded is research, which primarily results in evolutionary improvement to the existing state of practiceThe primary goal of this program is to establish the micro-systems technology for extremely light weight, low power cameras with the performance necessary for medium to short range applications. The components comprising the light weight camera include the optics, packaged detector, electronics and camera housing. Innovations in optical and detecting materials; sensor design and fabrication, signal processing, and micro-packaging are necessary to achieve goals for extremely light weight. PROGRAM SCOPE This program addresses development of sensor technology critical to micro-vehicle and head-mounted system applications, integration of sensor technology into a package consistent with the application, and demonstration of system prototypes. Micro-air and micro-ground platforms and helmet mounted applications require: sensor operation at room temperature or with extremely low power cooling and temperature stabilization, sensor micro-package with operational lifetime consistent with military operations, and optics and electronics consistent with the platform. The first phase of the program shall demonstrate the feasibility of integrating an imaging array into a micro-package of the size and weight necessary for the application and with performance compatible with system goals. This will include demonstration of the key attributes of the proposed approach, and paths to evaluate the risk. The measured data shall be supported by models and calculations predicting performance. Options may be exercised to continue the program after this initial demonstration. The second phase will consist of an integrated system feasibility demonstration for the proposed application. GENERAL INFORMATIONProposers must obtain a pamphlet entitled "BAA 06-46, Micro-Sensors for Imaging Proposer Information Pamphlet" which provides further information on Micro-Sensors for Imaging, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the FedBizOpps website: http://www.fedbizopps.gov/, Grants.gov website: www.grants.gov, DARPA website: http://www.darpa.mil/ (go to "solicitations", "MTO"), or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and four (4) copies of the proposal abstract and two electronic copies (i.e., two separate disks) of the abstract (in MS-Word readable (preferred), PDF, HTML, or ASCII format each on a single 3.5 inch High Density MS-DOS formatted 1.44 Megabyte (MB) diskette, a single 100 MB Iomega Zip disk, or a CD-ROM) should be submitted. Each disk must be clearly labeled with BAA 06-46, proposer organization, proposal title (short title recommended) and Copy __ of 2. The proposal abstract (original and designated number of hard and electronic copies) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 06-46), and it must be received by DARPA on or before 4:00 p.m., local time, November 15, 2006. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and four (4) copies of the full proposal and two electronic copies (i.e., two separate disks) of the full proposal [in MS-Word readable (preferred), PDF, HTML, or ASCII format, each on a single 3.5 inch High Density MS-DOS formatted 1.44 Megabyte (MB) diskette, a single 100 MB Iomega Zip disk, or a CD-ROM]. Each disk must be clearly labeled with BAA 06-46, proposer organization, proposal title (short title recommended) and Copy __ of 2. The full proposal (original and designated number of hard and electronic copies) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 06-46), and must be received by DARPA on or before 4:00 p.m., local time, January 12, 2007, in order to be considered during the initial round of selections; however, proposals received after this deadline may be received and evaluated up to one year from date of posting on FedBizOpps. University (prime) grant submissions may be made via the Grants.gov web site, http://www.grants.gov/, by using the "Apply for Grants" funtion. Dual submissions are not required. Full proposals received after the due date specified in the BAA or due date otherwise specified by DARPA after review of proposal abstracts may be selected contingent upon the availability of funds. This notice, in conjunction with the BAA 06-46 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Input on technical aspects of the proposals may be solicited by DARPA from non-Government consultants/experts who are bound by appropriate non-disclosure requirements. Non-Government technical consultants/experts will not have access to proposals that are labeled by their offerors as "Government Only". Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in Micro-Sensors for Imaging.All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 06-46. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of either of the above listed websites/links for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided (i.e., Frequently Asked Questions).EVALUATION CRITERIAEvaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (1) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, (5) realism of the proposed schedule; and (6) cost reasonableness and realism. The administrative addresses for this BAA are:Fax: (703) 696-2206 (Addressed to: DARPA/MTO, BAA 06-46), Electronic Mail: [email protected]: DARPA/MTO, ATTN: BAA 06-46 3701 North Fairfax Drive Arlington, VA 22203-1714
Federal Grant Title: Micro-Sensors for Imaging (MISI)
Federal Agency Name: DARPA Microsystems Technology Office
Grant Categories: Science and Technology
Type of Opportunity: Discretionary
Funding Opportunity Number: BAA06-46
Type of Funding: Grant
CFDA Numbers: 12.910
CFDA Descriptions: Research and Technology Development
Current Application Deadline: No deadline provided
Original Application Deadline: Jan 12, 2007
Posted Date: Oct 05, 2006
Creation Date: Nov 02, 2006
Archive Date: Oct 05, 2007
Total Program Funding:
Maximum Federal Grant Award: $0
Minimum Federal Grant Award: $0
Expected Number of Awards:
Cost Sharing or Matching: No
Applicants Eligible for this Grant
Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Link to Full Grant Announcement
Information not provided
Grant Announcement Contact
Michael Blackstone
Contracting Officer
Phone 571-218-4804 [email protected] Contracting Officer
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