CHIPS Incentives Program - Facilities for Semiconductor Materials and Manufacturing Equipment
The summary for the CHIPS Incentives Program - Facilities for Semiconductor Materials and Manufacturing Equipment grant is detailed below.
This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants.
Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact.
If any section is incomplete, please visit the website for the National Institute of Standards and Technology, which is the U.S. government agency offering this grant.
CHIPS Incentives Program - Facilities for Semiconductor Materials and Manufacturing Equipment: The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment for which the capital investment falls below $300 million. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email [email protected].
| Federal Grant Title: | CHIPS Incentives Program - Facilities for Semiconductor Materials and Manufacturing Equipment |
| Federal Agency Name: | National Institute of Standards and Technology (DOC-NIST) |
| Grant Categories: | Science and Technology |
| Type of Opportunity: | Discretionary |
| Funding Opportunity Number: | 2023-NIST-CHIPS-SMME-01 |
| Type of Funding: | Cooperative Agreement |
| CFDA Numbers: | 11.037 |
| CFDA Descriptions: | Information not provided |
| Current Application Deadline: | January 25th, 2024 |
| Original Application Deadline: | January 25th, 2024 |
| Posted Date: | September 29th, 2023 |
| Creation Date: | September 29th, 2023 |
| Archive Date: | March 2nd, 2024 |
| Total Program Funding: | |
| Maximum Federal Grant Award: | |
| Minimum Federal Grant Award: | |
| Expected Number of Awards: | |
| Cost Sharing or Matching: | No |
| Last Updated: | September 29th, 2023 |
- Applicants Eligible for this Grant
- Others (see text field entitled "Additional Information on Eligibility" for clarification.)
- Additional Information on Eligibility
- An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
- Link to Full Grant Announcement
- CHIPS Application Portal
- Grant Announcement Contact
- Misty Roosa
Management Analyst
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