DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap - Public Feedback

The summary for the DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap - Public Feedback grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact. If any section is incomplete, please visit the website for the Golden Field Office, which is the U.S. government agency offering this grant.
DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap - Public Feedback: This is a Request for Information (RFI) issued by the U.S. Department of Energy (DOE) on behalf of the Advanced Materials and Manufacturing Technologies Office (AMMTO). The intent of this RFI is to solicit feedback from affected stakeholders on the EES2 Initiative in general and on the draft Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) Research, Development, and Demonstration (RD&D) Roadmap that accompanies this RFI. The EES2 roadmap focuses on the energy efficiency of computing and the computing stack. Therefore, we have divided our roadmap into eight specialized working groups, each focusing on specific layers of the computing stack or on enabling technologies and approaches. Working group deliberations focused on identifying key emerging, energy-efficient technologies and their challenges and solutions. The EES2 working groups for version 1.0 are: a. Materials and Devices (MnD) b. Circuits and Architectures (CnA) c. Advanced Packaging and Heterogenous Integration (APHI) d. Algorithms and Software (AnS) e. Power and Control Electronics (PaCE) f. Manufacturing Energy Efficiency and Sustainability (MEES) g. Metrology and Benchmarking (MnB) h. Education and Workforce Development (EWD) Responses to this RFI must be submitted electronically to [email protected] no later than 5:00pm (EDT) on September 30, 2024. Responses must be provided as a Microsoft Word (.docx) attachment to an email. It is recommended that attachments with file sizes exceeding 25MB be compressed (i.e., zipped) to ensure message delivery. This RFI is not accepting applications for financial assistance or financial incentives. EERE may or may not issue a Funding Opportunity Announcement (FOA) based on consideration of the input received from this RFI. Please see the full RFI document for additional information.
Federal Grant Title: DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap - Public Feedback
Federal Agency Name: Golden Field Office (DOE-GFO)
Grant Categories: Energy
Type of Opportunity: Discretionary
Funding Opportunity Number: DE-FOA-0003426
Type of Funding: Other
CFDA Numbers: 81.086
CFDA Descriptions: Information not provided
Current Application Deadline: September 30th, 2024
Original Application Deadline: September 30th, 2024
Posted Date: August 14th, 2024
Creation Date: August 14th, 2024
Archive Date: October 30th, 2024
Total Program Funding: $0
Maximum Federal Grant Award: $2
Minimum Federal Grant Award: $1
Expected Number of Awards:
Cost Sharing or Matching: No
Last Updated: August 14th, 2024
Applicants Eligible for this Grant
Unrestricted (i.e., open to any type of entity below), subject to any clarification in text field entitled "Additional Information on Eligibility"
Link to Full Grant Announcement
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Grant Announcement Contact
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