Materials Characterization and Quantum Performance: Correlation and Causation (MQC) FY 23

The summary for the Materials Characterization and Quantum Performance: Correlation and Causation (MQC) FY 23 grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact. If any section is incomplete, please visit the website for the Air Force Office of Scientific Research, which is the U.S. government agency offering this grant.

Materials Characterization and Quantum Performance: Correlation and Causation (MQC) FY 23: The Air Force Office of Scientific Research (AFOSR), in collaboration with the Laboratory for Physical Sciences (LPS), is soliciting proposals for the “Materials characterization and Quantum performance: Correlation and causation” (MQC) program. This program takes a “materials-first” approach to improving stability and reproducibility of state-of-the-art quantum bits (qubits). MQC focuses on solid-state qubits, for use in gate-based quantum computing, built from semiconductor- and superconductor material systems. Of particular interest are Si-based gate defined quantum dots or Josephson junction-based quantum circuits . More specifically, the goal of the research to-be-funded under this FOA is to identify correlations between qubit performance metrics and material properties, where the main focus is on identifying material properties which can be characterized in a high throughput and precise manner. In addition, an equally important goal is to identify the underlying physical mechanisms giving rise to these correlations. These mechanisms shall be supported by detailed material characterization measurements as well as material micro-structure and device modeling efforts.