Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D)

The summary for the Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D) grant is detailed below. This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants. Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact. If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office , which is the U.S. government agency offering this grant.

Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D): The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.