National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)
The summary for the National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D) grant is detailed below.
This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants.
Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact.
If any section is incomplete, please visit the website for the National Institute of Standards and Technology, which is the U.S. government agency offering this grant.
National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D): Applications such as high performance computing and low-power electronics, both needed for artificial intelligence (AI), require leap-ahead advances in semiconductor advanced packaging. This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas: (1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).
| Federal Grant Title: | National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D) |
| Federal Agency Name: | National Institute of Standards and Technology (DOC-NIST) |
| Grant Categories: | Science and Technology and other Research and Development |
| Type of Opportunity: | Discretionary |
| Funding Opportunity Number: | 2025-NIST-CHIPS-NAPMP-01 |
| Type of Funding: | Other |
| CFDA Numbers: | 11.042 |
| CFDA Descriptions: | Information not provided |
| Current Application Deadline: | December 20th, 2024 |
| Original Application Deadline: | December 20th, 2024 |
| Posted Date: | October 18th, 2024 |
| Creation Date: | October 18th, 2024 |
| Archive Date: | January 19th, 2025 |
| Total Program Funding: | |
| Maximum Federal Grant Award: | |
| Minimum Federal Grant Award: | |
| Expected Number of Awards: | 10 |
| Cost Sharing or Matching: | No |
| Last Updated: | October 18th, 2024 |
- Applicants Eligible for this Grant
- Others (see text field entitled "Additional Information on Eligibility" for clarification.)
- Additional Information on Eligibility
- Eligible applicants are domestic non-profit organizations; domestic accredited institutions of higher education; State, local, and Tribal governments; and domestic for-profit organizations. A domestic entity is one that is incorporated within the United States (including a U.S. territory) with its principal place of business in the United States (including a U.S. territory).
- Grant Announcement Contact
- Misty L Roosa
Management Analyst
Agency Contact - Similar Government Grants
- • CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes...
- • FY2024 CHIPS Manufacturing USA Institute Competition
- • Small Business Innovation Research (SBIR) Program for CHIPS For America - CHIPS Metrology
- • FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Sub...
- • FY 2025 NIST Small Business Innovation Research Program Phase I
- • Precision Measurement Grant Program
- • MEP Center State Competition
- • FY2024 Manufacturing USA Institute - AI for Resilient Manufacturing