Next-Generation Microelectronics Manufacturing (NGMM)
The summary for the Next-Generation Microelectronics Manufacturing (NGMM) grant is detailed below.
This summary states who is eligible for the grant, how much grant money will be awarded, current and past deadlines, Catalog of Federal Domestic Assistance (CFDA) numbers, and a sampling of similar government grants.
Verify the accuracy of the data FederalGrants.com provides by visiting the webpage noted in the Link to Full Announcement section or by contacting the appropriate person listed as the Grant Announcement Contact.
If any section is incomplete, please visit the website for the DARPA Microsystems Technology Office, which is the U.S. government agency offering this grant.
Next-Generation Microelectronics Manufacturing (NGMM): Amendment 02 - The purpose of this amendment is to extend the Full Proposal Due Date to October 12, 2022. The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation.
Federal Grant Title: | Next-Generation Microelectronics Manufacturing (NGMM) |
Federal Agency Name: | DARPA Microsystems Technology Office (DOD-DARPA-MTO) |
Grant Categories: | Science and Technology |
Type of Opportunity: | Discretionary |
Funding Opportunity Number: | HR001122S0050 |
Type of Funding: | Cooperative Agreement |
CFDA Numbers: | 12.910 |
CFDA Descriptions: | Information not provided |
Current Application Deadline: | October 12th, 2022 |
Original Application Deadline: | October 12th, 2022 |
Posted Date: | August 5th, 2022 |
Creation Date: | August 5th, 2022 |
Archive Date: | March 5th, 2023 |
Total Program Funding: | |
Maximum Federal Grant Award: | |
Minimum Federal Grant Award: | |
Expected Number of Awards: | |
Cost Sharing or Matching: | No |
Last Updated: | October 3rd, 2022 |
- Applicants Eligible for this Grant
- Others (see text field entitled "Additional Information on Eligibility" for clarification.)
- Additional Information on Eligibility
- All responsible sources capable of satisfying the Government's needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information.
- Link to Full Grant Announcement
- SAM.gov Contract Opportunities
- Grant Announcement Contact
- BAA Coordinator
HR001122S0050@darpa.mil
- Similar Government Grants
- • Compartmentalization and Privilege Management (CPM)
- • Pipelined Reasoning Of Verifiers Enabling Robust Systems (PROVERS)
- • Faithful Integration and Reverse-engineering and Emulation (FIRE)
- • Multiobjective Engineering and Testing of ALloy Structures (METALS)
- • NanoWatt Platforms for Sensing, Analysis, and Computation (NaPSAC)
- • Wide Band Gap Semiconductors for RF Applications (WBGS-RF)
- • Robust Integrated Power Electronics (RIPE)
- • Microantenna Arrays:Technology and Applications (MIATA)
- More Grants from the DARPA Microsystems Technology Office
- • Faithful Integration and Reverse-engineering and Emulation (FIRE)
- • Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minither...
- • Space Power Conversion Electronics (SPCE)
- • H6
- • Microsystems Technology Office (MTO) Office-wide